Microconnex
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Microconnex
Our high-density flex circuit applications engineers take your big ideas and make them a reality. We will turn around your standard flex circuit prototype, accelerating your time to market. Together we offer expanded Medical and Test & Measurement capabilities to support your critical and cost-effective performance requirements.

Precision laser micromachining and laser drilling to sub 2.5 m tolerance at 15 m feature size. Deposition of low stress metal alloy and oxide thin films for custom manufacturing and advanced R&D applications. We collaborate with you before and during production to ensure your flex circuit prototype is optimized for manufacturing.
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At MicroConnex, we are proud of our reputation as the quickest quick-turn provider of flexible circuit solutions. We have earned this distinction by pushing the edge of accepted limits and succeeding where others have failed. Partner with us to solve your toughest design dilemmas. If you require a fine-pitch flex circuit, laser micromachining services, thin film deposition, or flex circuit manufacturing, we can help.
MicroConnex was founded by Thomas Clary and Scott Corbett in 1995 as MicroSound Systems, an R&D company exploring complex new designs and manufacturing methods for ultrasound transducers using laser drilling and micromachining. MicroSound received contracts from DARPA and the US Navy as part of a battlefield imaging emphasis.
Your Total Solution for Flex Prototypes, Laser Micromachining, and Thin Film Deposition That Scale to Manufacturing. We are best known for our highly creative and imaginative team of flex circuit engineers who can produce your multilayer, high-density (1 mil trace/space) flex prototype in 15 days or less.
As a cutting-edge flex circuit manufacturer, our experience and capabilities can give your design a competitive advantage. We fabricate to your specifications while contributing DFM and integration expertise on HDI flex circuits, laser drilling, and cutting on thin materials. MicroConnex operates within the ISO 9001 framework to ensure quality and consistency from proto to manufacturing.
Our technical teams can produce your standard flex prototype in 5 days and developmental flex prototype in 15 days. Challenge us with multilayer, sub 2-mil thickness, tight registration, and a high number of traces. Give us your toughest HDI with a specific RF performance requirement. Ask us to make your flex circuits smaller, lighter, and more reliable.
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