Pin 1 offers prototype and small volume assembly / packaging services to the integrated circuit community. Services include but are not limited to RFIC, MMIC, opto-electronics, medical, commercial and military applications. From small lot quick-turns to continual or recurrent assembly requirements for your standard devices, Pin 1 can assemble your device and bill of materials dependably and accurately.
All process steps are performed in a clean environment with ESD protection and static monitoring throughout.
All process steps are performed in a clean environment with ESD protection and static monitoring throughout.
Services
Pin 1 Technology was established in 2007 in Fremont, CA to serve local and nationwide fabless chip design companies. From ASIC, MMIC, RF, solar, opto, LED hybrid, MCM, and power devices to military, commercial, and medical applications, Pin 1 has built many custom requirements, to spec, on time, and with high functional yields.
Provide a standard bond diagram, your device for package, substrate materials, and we'll do the rest. If you are pressed for time to deliver prototypes, mockups, or samples, our facility can put together a small lot size of devices quickly, economically and within your timeframe. Continual assembly requirements from 10 to 1000 units of any device type can be produced based on weekly or monthly demand.
Pin 1 can provide high speed singulation of wafers, ceramic substrate, plastic encapsulated devices. Using various dicing blade composite materials, complete separation and singulation of hard, brittle, metallic, polymer compositions is completed cleanly and quickly. The singulation process utilizes de-ionized H2O for ESD control.
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