StratEdge to Present Glass Sidewall for Power Semiconductors and Ceramic Packages for 5G at IMAPS 2021 Live. StratEdge announces that StratEdge technical experts will be available to discuss the best types of packaging and assembly services for devices at the LIVE International Symposium for Microelectronics (IMAPS) 2021 in San Diego, California.
StratEdge On-demand Webinar about Packages and Eutectic Die Attach for GaN Devices is Now Available. StratEdge announces that the on-demand webinar, "Packages and Eutectic Die Attach for High-power GaN Devices, " is now available on the StratEdge website.
StratEdge On-demand Webinar about Packages and Eutectic Die Attach for GaN Devices is Now Available. StratEdge announces that the on-demand webinar, "Packages and Eutectic Die Attach for High-power GaN Devices, " is now available on the StratEdge website.
Services
StratEdge offers the industry's deepest product line of microwave and mmwave packages. StratEdge packages are currently used in all applications requiring clean microwave RF performance including; aerospace, telecommunications, VSAT and other satellite communications, and high frequency test and measurement equipment.
StratEdge has hundreds of MC Series semiconductor packages in standard, open-tooled configurations, with some designs optimized to operate at frequencies up to 18 GHz. All of the MC packages are MIL-STD hermetic packages. If you need a surface mount package, StratEdge can provide these packages with gull-wing formed leads.
The Leaded Laminate (LL) Series was designed specifically for the packaging of high power Gallium Nitride (GaN) products. These products provide enhanced thermal dissipation of the GaN devices through the use of several design and material improvements, including the use of Copper:Molybdenum:Copper (CMC) laminates for the eutectic solder attachment of the die.
Designed originally for VSAT, the StratEdge LPA/LL Series are ultra low loss leaded packages. Using a thermally conductive copper composite base, StratEdge engineers incorporated a patented microstrip-imbedded microstrip-microstrip transition on the alumina ceramic ring frame. The metal base and leads are attached to the ceramic with copper-silver braze, a high temperature (> 600 deg C), high strength material that provides fantastic reliability.
The StratEdge SE50 Series are DC to 63 GHz off-the-shelf packages with ultra-low electrical loss. StratEdge's SE50 family is the original drop-in package design for these frequencies. With a thermally conductive copper composite base and its revolutionary patented microstrip-imbedded microstrip- microstrip transition design, the SE50 package provides superior electrical performance even in thermally stressful environments.
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