Grinding Technology

In the beginning our customer base consisted of traditional automotive, aerospace and general manufacturing customers. Shortly thereafter, we began working with one our principles, GMN, and Bell Lab's engineers to develop the first silicon wafer backside grinders for the fledgling semiconductor industry.

Takatori produces a full line of equipment for protective tape lamination prior to back grinding, tape removal, and mounting onto dicing frames. Ready for the most demanding thin-wafer application, including Taiko wafers, Takatori has been producing tape, detape, and mounting equipment for over 25 years.

Takatori diamond wire saws are the industry standard for slicing sapphire and other advanced materials. Featuring high wire speeds and the original rocking head, Takatori diamond wire saws offer high-speed slicing of even the hardest materials with top notch quality. The original wire saws, Takatori multi-sire slurry saws are used for slicing a wide variety of challenging, valuable material.

The Takatori TWR-300 wire saw is a new innovation for the cutting of composite materials including aramid and aluminum honeycomb, sandwich panels, and CFRP including very thick CFRP. Taking advantage of Takatori's 20 years of experience in wire sawing, the TWR-300 uses diamond-coated wire to cut, resulting in minimal material loss, minimal damage, and significantly reduced particle generation.